Techwin

We attended Vietnam International Communications Summit & Expo 2011

We  attended Vietnam International Communications Summit & Expo 2011
Place: Vietnam Exhibition & Fair Center, Hanoi, SR Vietnam
Exhibition Date:November 16 – 19, 2011
Booth Number: 3C19

There are a lot of customer come to our booth to see the showing of our best model Fuson Splicer TCW-605,they are all satisfied with the performance of the fusion splicer TCW-605,some one of them are very interested to buy some sample.also express their interest to be our distributor in Vietnam